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Introduction to Cyclic Voltammetric Stripping (CVS)

Dec 16, 2024

Article

This article explores the use of Cyclic Voltammetric Stripping (CVS) analysis to monitor the concentration of organic additives in copper electroplating baths. Additives like suppressors, brighteners, and levelers are essential for achieving uniformity, smoothness, and optimal copper thickness. Therefore, the focus will be on various measurement techniques used to quantify these additives, including Dilution Titration (DT), the Modified Linear Approximation Technique (MLAT), and the Response Curve (RC).

Plating and printed circuit boards

Example representation of a printed circuit board (PCB) with various elements like conductive traces, solder pads, and vias.
Figure 1. Example representation of a printed circuit board (PCB) with various elements like conductive traces, solder pads, and vias.

Plating is the process of coating a thin layer of metal onto the surface of an object. It is commonly used across various sectors, including automotive, aerospace, jewelry, medical devices, industrial equipment, and electronics. Electrochemical deposition of copper is commonly used in various processes like semiconductor chip production (e.g., through-silicon vias or TSVs), advanced chip packaging (microbumps), or printed circuit board (PCB) manufacturing.

Printed circuit boards are the backbone of modern electronics. They serve as a physical platform where electrical connections and components are integrated. A PCB structure typically consists of multiple layers made from a combination of conductive and insulating materials. In these layers, structures like traces (copper pathways for conducting signals and current), pads (copper areas for soldering components), and holes are incorporated (Figure 1).